ESEC MICRON 2

Description

ESEC MICRON 2:
- high-precision, modular component placement system
- can be adapted to different production tasks such as the placement of SMD and DIE components
- maximum number of different components which can be simultaneously processed is 64
- has been developed for different present day and future technologies
- due to the extreme precision of the system, all components up to a size of 0.25 mm x 0.25 mm to 30 mm x 30 mm can be placed
- special tape feeders have been designed for dies and flip chips
- up to 42 die feeders can be installed on the Micron 2
- can handle boards panels, flex substrates, boats with singulated substrates, and lead frames up to size 10 x 14"
- wear-free air bearings, glass scales, granite base, and ceramic beams
- 5 micron repeatability
- 12 micron placement
- angular resolution: 0.05 degrees
- minimum pitch: 0.1 mm
- throughput: varies with process ( typical flip chip = 800-1200/hour)
- 7-axis hot-bar assembly head with force sensing
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*****PLEASE NOTE:*****
TAXES ARE THE RESPONSIBILITY OF THE BUYER
ALL SHIPPING/PICKUP IS THE RESPONSIBILITY OF THE BUYER
IN "AS-IS/WHERE-IS" CONDITION
AVAILABLE FOR INSPECTION PRIOR TO PURCHASE
AVAILABLE FROM MACROTRON SYSTEMS