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Beamworks Spark 400 Laser Solder Pick and Place Dispenser SMT PCB

$ 18480

Availability: 100 in stock
  • Condition: Used
  • All returns accepted: ReturnsNotAccepted
  • Country/Region of Manufacture: Israel
  • Model: Spark 400
  • Brand: Beamworks

    Description

    Very Nice Beamworks Spark 400 Selective Laser Solder Machine For Sale
    See attached pictures and information below
    Solder Paste Dispensing
    Rotary positive displacement pump with Archimedean screw
    For accurate and controlled paste deposit
    Dispensing Capability
    Line dispensing: down to 0.4 mm (0.016”) pitch
    Dot dispensing: down to 0.3 mm (0.012”) in diameter
    Capability to dispense solder paste or epoxy dots and lines
    Pick & Place
    Feeder slots - 29 standard
    MTH (Matrix Tray Handling)- 3 standard (configuration dependant)
    Up to 20 in a magazine handler (optional)
    Component handling - Up to 75 mm (2.95”) and down to 0402
    Throughput - Up to 1, 000 CPH
    Vision capability - Matrox based algorithms
    Laser Soldering Module
    2 laser diodes - 30 W each
    Independent optical system for each laser to direct XY movement
    Closed loop operation utilizing IR sensors to control solder joint temperature
    Input Data
    Standard CAD files
    Also requires BOM file
    Combined CAD & BOM
    Converted P&P machine file - Using on-board file converter
    Components library size
    2000 SMT components
    Jedec tray library size
    125 trays
    Complete with PC, Keyboard, Monitor, Mouse, and Manuals
    Dimensions: 1, 000mm x 1, 300mm x 1, 600mm
    Weight: 900 Kg
    230 Volt - 50 HZ - 32 AMPS - Single Phase
    110 Volt - 60 HZ - 32 AMPS - Double Phase
    Typical Applications
    Quick Turn Prototype Assembly
    NPI and Small Lot Production
    Complete SMT Assembly Line for Engineering Labs
    Automated Mass Rework, Including BGAs
    Selective Assembly of Planned (and Unplanned) Missing SMT Components
    Selective Assembly of SMT Connectors, RF Shields, Through Hole Components, Heat Sensitive Components, Paste in Hole, Optical Components and Smart Cards, Moisture Sensitive Components
    Lead Free High Temperature Soldering
    Re-balling All types of BGA
    Flip-Chip & CSP Assembly
    Unique & special Applications
    Main Benefits:
    Closed Loop Temperature Controlled Soldering
    No Stencil Required
    Flexible Operation Allows for Fast Turn Around
    Precise Heating without impacting Adjacent Components
    Auto Load of CAD and BOM Data
    Small Footprint
    Thin Inter-metallic Layer for Improved Reliability
    No Baking of Moisture Sensitive Components
    Full SMEMA Support Allows IN-Line Operation
    Either Stand Alone or In-Line Operation
    Buyer is responsible for all shipping charges from our location
    We can set up packaging and shipping to countries overseas by boat or airplane
    Installation and Training available at extra cost!!
    Please let us know if you have any questions or concerns
    Thanks and have a nice day!